Research2026-05-06
2D-ThermAl: Physics-Informed Framework for Thermal Analysis of Circuits using Generative AI
Source: Arxiv CS.AI
arXiv:2512.01163v2 Announce Type: replace-cross Abstract: Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based...
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